Die-Attach Materials for High Temperature Applications in Microelectronics Packaging

DIE-ATTACH MATERIALS FOR HIGH TEMPERATURE APPLICATIONS IN MICROELECTRONICS PACKAGING

AUTHOR BY KIM S. SIOW

  • Release : 29 January 2019
  • Publisher : Springer
  • Pages : 279
  • Categories : Technology & Engineering / Materials Science / Electronic Materials
  • ISBN: 3319992562
  • Rating: 4.5/5 from 265 user votes
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